Thermal Aluminum Solutions for AI & High-Density Computing
Engineered to manage extreme heat flux in next-generation AI infrastructure.
Designed for High Heat Density
AI servers and HPC systems generate concentrated heat loads that require efficient and reliable thermal management.
Our thermal aluminum products are designed to support air cooling, liquid cooling, and hybrid architectures, and to assist in achieving stable performance under validated operating conditions.
Cold Plates (Liquid Cooling)
Aluminum alloy cold plates designed to support direct-to-chip and module-level liquid cooling.
Key Features
Internal flow channels designed to enhance liquid cooling performance
Supports efficient heat transfer in compact modules
Compatible with modern liquid cooling systems
Aluminum Vapor Chamber Structures
Aluminum-based vapor chamber structures designed to support advanced thermal spreading and improved temperature uniformity.
Key Features
Internal structures designed to assist effective heat distribution
Supports reduction of thermal gradients in target components
Suitable for high-performance AI components, subject to project-specific evaluation
Compatible with Modern Cooling Architectures
Our thermal aluminum solutions are designed to support evaluation of a range of cooling strategies, including:
Air cooling designed to enhance efficiency
Direct-to-chip liquid cooling for component-level validation
Hybrid air-liquid systems concepts for combined thermal management
Project-specific evaluation for next-generation thermal architectures
Thermal Performance Enhancement
For applications aiming for improved thermal performance, we provide engineering support for functional material integration, including:
Graphene-enhanced thermal interfaces and coatings for evaluation and prototype use
CNT-based conductive layers designed to assist thermal and multifunctional performance
Custom hybrid thermal solutions concepts for project-specific AI workloads
Application Scenarios
Optimize Thermal Performance for AI Systems
AI & HPC–related thermal management applications
High-power electronic components and assemblies
Advanced cooling solutions at component or module level
Next-generation aluminum-based infrastructure concepts and pilot projects