Engineering support for aluminum systems with potential enhancements in thermal, electrical, and functional performance based on project-specific evaluation.
From Material Selection to Concept-Level Performance
We support customers in exploring next-generation aluminum systems by combining structural aluminum with advanced functional materials where applicable, such as in graphene-enhanced coatings and CNT-based concept evaluations.
These activities focus on early-stage prototyping and validation, with performance gains evaluated on a project-specific basis.
Advanced Material Capabilities
Graphene-Based Functional Materials (Exploratory & Evaluation Support)
Support evaluation of thermal enhancement layers
Concept-level heat-spreading surface coatings
Concepts for lightweight performance optimization
CNT-Based Functional Materials (Proof‑of‑Concept Support)
Support evaluation of conductive and multifunctional layers
Investigation of hybrid electrical‑thermal performance
Conceptual support for structural‑functional integration
Hybrid Aluminum Material Concepts
Exploration of aluminum + functional coatings
Aluminum + composite surface layers concepts
Multi‑material interface feasibility studies
Our Co-Development Workflow
Step 1 – Requirement Definition
Step 2 – Material & Structure Strategy
Step 3 – Prototype & Performance Evaluation
Step 4 – Feasibility Refinement and Scaling Exploration
Scaling and manufacturability are subject to project validation and performance outcomes, and are discussed collaboratively with customers.
Designed for Manufacturability&Where Co-Development Creates Value
Flexible Collaboration Models
All collaborative development activities are evaluated with manufacturing feasibility and performance validation in mind.
The goal is to support engineering solutions that may progress from prototype evaluation to scalable implementation based on project results and aligned customer requirements.
Sample focus areas for co‑development collaboration (subject to validation and customer requirements):
AI data center infrastructure components
Server and liquid cooling assemblies
High‑power electronics thermal & structural interfaces
Advanced thermal management application concepts