Thermal & Structural Aluminum Solutions for AI Servers
Engineered to manage extreme heat density in next-generation AI computing.
AI workloads generate unprecedented heat density at the server and rack level.
Traditional cooling and materials struggle to balance thermal performance, structural stability, and scalability.
Cooling efficiency is no longer optional — it directly impacts performance, reliability, and operating cost.
Aluminum Heat Sinks
Extruded, CNC-machined, or folded-fin aluminum heat sinks
Optimized for high power density AI components
Cold Plates for Liquid Cooling
Aluminum alloy cold plates for direct-to-chip cooling
Designed for high flow efficiency and thermal stability
Cooling Structural Channels
Aluminum airflow guides and liquid cooling channels
Structural components that double as thermal management elements
Server Chassis & Thermal Frames
Lightweight aluminum server enclosures and internal frames
Support both air and liquid cooling architectures
Performance Enhancement with Advanced Materials
To push thermal performance beyond conventional aluminum, we explore the integration of advanced materials where appropriate:
Graphene-enhanced thermal interfaces and coatings for experimental or specialized applications
CNT-based conductive and functional layers for targeted performance improvements
Custom hybrid designs to address demanding AI thermal loads, with materials implemented as validated
Application Scenarios
AI & GPU Servers
High-Performance Computing (HPC)
Liquid-Cooled Server Racks
Edge AI Systems